972 393 6888 fax 972 393 6889.
Ceramic substrates amp.
World headquarters 1122 w bethel rd 400 75019 coppell tx usa.
A 210 90 mm 2 rectangular shaped ceramic plate of 90 wt in 2 o 3 and 10 wt sno 2 purity 99 99 was used as target.
Ceramtec metalizes these substrates manufactured for use in electronic circuits in house.
Modern electronics are based on the integrated circuit an assembly of millions of interconnected components such as transistors.
At ceramic substrates we operate with a bank of nine cnc s twelve traditional lathes and mills producing fully engineered machinable ceramic components six days a week.
Ceramtec develops the metalization pastes itself and these pastes are characterized by their high bond strength good solder flow and.
Our precision etching technology pushes thick film ceramic substrates to a best in class position offering the tightest tolerances and the highest performances rivaling thin film capabilities.
Ceramtec s own metalized substrates are optimally suited for directly mounting electronic components onto ceramic.
510 661 4287 applied thin film products atp offers build to print services for a wide range of materials and metalization schemes.
If it s possible in thin film chances are it can be realized in etched thick film at a fraction of the price.
Metallized ceramic substrates have a structure in which metal plates are bonded to both sides of the insulating ceramic substrate as discussed in section 3 1.
44 0 1983 822252 email.
Atp fabricates circuits on substrates using as fired alumina polished alumina aluminum nitride beryllium oxide fused silica quartz sapphire and hi k dielectrics.
The target to substrate distance was kept constant at 80 mm.
Both substrates and target were separately presputtered in pure ar atmosphere respectively for 25 minutes at 5 pa and for 10 minutes at 1 pa.
Website usage terms and conditions.
The metal plate on one side functions as a conductor circuit while the one on the other side functions as the heat spreader while playing the role of an electrical insulator between a semiconductor device and the heat sink and the.
44 0 1983 528697 fax.
Electronic substrate and package ceramics advanced industrial materials that owing to their insulating qualities are useful in the production of electronic components.
In sizes larger than 6 od metallic substrates are competitive with ceramic and sizes larger than 10 metallic s have a lower cost.
