Ceramic Substrates And Packages For Electronic Applications

Kyocera ecu substrates provide high density circuit design high temperature durability good heat dissipation and high reliability with multilayer ceramics. Direct bonded copper dbc substrates are commonly used in power modules because of their very good thermal conductivity they are composed of a ceramic tile commonly alumina with a sheet of copper bonded to one or both sides by a high temperature oxidation process the copper and substrate are heated to a carefully controlled temperature in an atmosphere of nitrogen containing about 30 ppm. The outstanding surface quality on both sides makes it the perfect companion for any commercial thick film paste and even makes it suitable for a number of thin film applications sputtering.

corrugated steel sheet dimensions ceramic quarter round wall trim tile colored plastic sheets for lights ceramic soccer ball floral container esb attic insulation ceramic tile dog paw cuts chamberlain liftmaster professional garage door opener parts ceramic tile wall murals

Multilayer Ceramic Substrates For Ecus Ceramic Packages For Automotive Electronics Ceramic Packages Products Kyocera

Ltcc And Htcc Packaging Schott Ag

Large Scale Substrate For Wafer Testers

High Temperature Co Fired Ceramic Htcc Package And Substrate

Ceramic Substrate An Overview Sciencedirect Topics

Quality Beo Ceramic Materials Si3n4 Ceramic Manufacturer Ceramic Materials Structural Analysis Material Specification

This ceramic material is characterized by its extremely high strength and thermal conductivity.

Ceramic substrates and packages for electronic applications.

Among the ceramics employed as electronic substrates and packages the dominant material is alumina aluminum oxide al. The most economically important types of electronic ceramics include substrates integrated circuit ic packages and multichip modules capacitors ferrites insulators piezoelectrics and superconductors world electronics development 1998. Printed resistors and high current capacity trough conductive line structures are also available. Hermetic microelectronic packages also often referred to as hybrid packages multi chip module housings or ic packages are used to package and thereby protect sensitive electronic components and complete electrical assemblies from harsh environmental conditions including high temperature shock and vibration resistance.

Substrates made from rubalit alumina ceramics. Over 150 us companies produce or supply electronic ceramics. Htcc high temperature co fired ceramics alumina system and ltcc low temperature co fired ceramics glass ceramic system are available. At the same time the vacuum tight housings and substrates must.

Rubalit 708 s with 96 al 2 o 3. The insulating properties of ceramics are well known and these properties have found application in advanced ceramic materials for substrates and packages. The materials and products are described in this article.

Home Ceramic Materials Substrate Ceramics

Surface Mount Ceramic Packages For Electronic Devices Ceramic Packages Products Kyocera

Quality Beo Ceramic Materials Si3n4 Ceramic Manufacturer Ceramic Materials Advanced Ceramics Ceramics

Thin Film Metallized Substrates Products Maruwa Co Ltd

Source : pinterest.com